MICROFJ-60035-TSV-TR1 Onsemi

The MICROFJ-60035-TSV-TR1 from Onsemi is a high-performance Silicon Photomultiplier (SiPM) sensor, belonging to the MICROFJ series. This single-type sensor features a compact 6 mm x 6 mm active area composed of microcells with a 35 µm pitch, optimized for detecting light in the blue/violet spectrum with a peak wavelength of 420 nm. It delivers a high Photon Detection Efficiency (PDE) of 50% at maximum overvoltage and a low Dark Count Rate (DCR) of 50 KHz/mm² under typical bias, making it ideal for applications requiring high sensitivity to low-light levels. Packaged in a wafer-level chip-scale package (ODCSP-36/WBGA-36), it is designed for integration into advanced systems such as medical imaging, LiDAR, and high-energy physics experiments.

Features

• High Photon Detection Efficiency: Achieves 50% PDE at the specified maximum overvoltage, ensuring excellent sensitivity for low-light signal capture.
• Low Dark Count Rate: Features a typical DCR of 50 KHz/mm², minimizing noise for improved signal-to-noise ratio in critical measurements.
• Optimized Spectral Response: Peak sensitivity at 420 nm wavelength, making it particularly suitable for detecting blue/violet scintillation light.
• Advanced Microcell Technology: Utilizes 35 µm microcells within a 36 mm² active area, providing a fine resolution for photon counting applications.
• Compact Surface-Mount Package: Supplied in a space-saving ODCSP-36 (WBGA-36) package on tape and reel, facilitating automated assembly.

Technical Specifications

• Status: Active
• Compliance: PbAHP
• Package Type: ODCSP-36
• Case Outline: 570CP
• MSL Rating: MSL 4 @ 260°C
• Active Area: 6 mm x 6 mm
• Microcell Pitch: 35 µm
• Peak Wavelength: 420 nm
• Photon Detection Efficiency (PDE): 50% @ Max Overvoltage
• Dark Count Rate (DCR): 50 KHz/mm² @ Typical Overvoltage
• Type: Single

Pin Configuration and Functions

• No pin definition: As a monolithic silicon photomultiplier sensor, the device does not have individually functional digital or analog pins in the conventional IC sense. The WBGA-36 package connections are primarily for the common cathode, common anode, and bias distribution across the microcell array. Refer to the official manufacturer datasheet for the detailed pad layout and recommended connection schematic.

Typical Applications

• Medical Imaging: Detection of scintillation photons in positron emission tomography (PET) and computed tomography (CT) systems.
• LiDAR and Ranging: High-sensitivity receiver module for automotive, industrial, and topographic LiDAR.
• High-Energy Physics: Particle detection and radiation monitoring in experimental setups.
• Biotechnology: Fluorescence detection and analysis in lab-on-a-chip and flow cytometry instruments.

Equivalent / Alternative Parts

• Information Not Provided: Equivalent or alternative parts cannot be reliably recommended without access to a comprehensive cross-reference database. Please consult the manufacturer or distributor for pin-to-pin alternatives within the MICROFJ series.

Advantages

• Superior Low-Light Performance: The combination of high PDE and low DCR provides outstanding sensitivity, crucial for detecting weak optical signals in scientific and medical instrumentation.
• Compact Form Factor: The 6x6 mm active area in a wafer-level CSP allows for high-density array configurations and integration into space-constrained modern devices.
• Fine Resolution Sensing: The 35 µm microcell size enables finer spatial resolution for photon event localization compared to sensors with larger microcells.

Limitations

• Moisture Sensitivity: With an MSL 4 rating, the device is moisture-sensitive and requires baking and dry storage before use to prevent package damage during reflow.
• Spectral Specificity: Peak sensitivity at 420 nm may render it less optimal for applications primarily using light sources in the red or infrared spectrum without appropriate wavelength shifting.
• Requires Careful HV Biasing: As a SiPM, it requires a stable, low-noise high-voltage bias supply and may be susceptible to damage from overvoltage transients.

Package Information

ODCSP-36 wafer-level chip-scale package (also referred to as WBGA-36), following case outline 570CP. This is a surface-mount package designed for high-density PCB assembly.

Manufacturer Information

Onsemi is a leading global supplier of semiconductor-based solutions, focused on key megatrends including vehicle electrification, sustainable energy, and industrial automation. The company offers a comprehensive portfolio of power management, sensing, and analog solutions known for their reliability and performance.

Design-in Tips

• Handle with MSL 4 Protocols: Adhere strictly to Moisture Sensitivity Level 4 handling procedures. Bake the device if the exposure time exceeds the specified floor life and use within 72 hours after opening the dry pack.
• Implement Precise Bias Control: Design a stable, low-noise bias supply with proper filtering. The operating characteristics (PDE, DCR) are highly dependent on the applied overvoltage; precise voltage control is essential for consistent performance.
• Optimize Optical Coupling: Ensure proper optical interface design (e.g., using coupling gels or direct bonding) between the sensor's active area and the light source (scintillator, fiber) to maximize photon collection efficiency.

Lifecycle Status & PCN/PDN Notes

Lifecycle Status: Active. No product change notifications (PCN) or product discontinuation notices (PDN) are referenced in the provided parameters.