Blogs

In this comprehensive guide, we’ll cover everything you need to know about the CR2412 battery—including its specifications, features, common equivalents, applications, trusted brands, and safe handling practices.

This in-depth guide covers everything you need to know about the CR1025 battery, from voltage and dimensions to manufacturers, equivalents, and safety precautions.

In this blog post, we’ll explore the Top 10 Mobile AI Chip Providers in 2025, offering in-depth profiles of each vendor, comparing technical capabilities, and analyzing market implications.

The 2025 edge AI chip landscape rewards those blending architectural innovation, software agility, and regional partnerships. NVIDIA and Huawei lead via full-stack ecosystems, while disruptors like Axelera AI prove specialized NPUs can outmaneuver giants.

By 2026, the arrival of 3nm and 2nm SoCs in one-third of flagship smartphones will mark a turning point in mobile computing, with profound implications for performance, energy efficiency, and AI capabilities.

Samsung Electronics is reportedly shifting its strategic priorities to strengthen its current cutting-edge nodes—particularly 2nm and 4nm—while delaying mass production of its next-generation 1.4nm (SF1.4) process until 2028 or 2029

Tesla will mass-produce the world's most powerful intelligent driving chip, with a computing power of 2500TOPS, far exceeding Nvidia. The launch of Tesla's AI 5 chip not only achieved a major breakthrough in computing power, but will also have a far-reaching impact on Tesla in terms of technology, business and ecology.

In the past two days, more leaks have enriched the configuration information of Nova Lake processors, including support for DDR5-8000 memory, LGA1954 package, etc. I believe that readers who have been paying attention to Intel PC processors for a long time may be a little surprised by the leaked 52 cores.

In June 2025, TSMC's Fab 21 in Arizona marked a historic milestone for U.S. semiconductor manufacturing by completing its first batch of 4nm wafers—totaling 20,000 units.

The analysis pointed out that Huawei's four-chip packaging architecture has technical similarities with NVIDIA's Rubin Ultra platform planned to be launched in 2026. The latter uses TSMC's CoWoS-L technology to integrate four GPUs and six HBM3E memories, while Huawei's patent achieves a similar effect through self-developed packaging technology.