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EXPERT IN SUPPLY CHAIN SERVICES FOR Scarce Electronic Components

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High-Demand Parts

BZV55C10-TPBZV55C10-TP

Micro Commercial Components

Zener Diode Single 10V 6% 15Ohm 500mW 2-Pin Mini-MELF T/R

GBLA02HD2GGBLA02HD2G

Taiwan Semiconductor

Bridge Rectifier Single Phase Standard 200 V Through Hole GBL

LTC4361ITS8-2#TRPBFLTC4361ITS8-2#TRPBF

Analog Devices

Overvoltage/Overcurrent Protection Controller

TLP785(TP6,F)TLP785(TP6,F)

Toshiba

Optocoupler DC-IN 1-CH Transistor DC-OUT 4-Pin PDIP T/R

SBL1040CT804HE3/45SBL1040CT804HE3/45

Vishay

Diode Array 1 Pair Common Cathode 40 V 5A Through Hole TO-220-3

AP2115R5A-1.8TRG1AP2115R5A-1.8TRG1

Diodes Incorporated

LDO Regulator Pos 1.8V 1A 6-Pin(5+Tab) SOT-89 T/R

SMBJP6KE20CAHE3-TPSMBJP6KE20CAHE3-TP

Micro Commercial Components

27.7V Clamp 22A Ipp Tvs Diode Surface Mount DO-214AA (SMB)

DMG4932LSD-13DMG4932LSD-13

Diodes Incorporated

Robust SOIC package suitable for high-reliability designs

Blogs

Intel Is About To Launch a 52-Core CPU Nova Lake: A Paradigm Shift Beyond Performance

Intel Is About To Launch a 52-Core CPU Nova Lake: A Paradigm Shift Beyond Performance

In the past two days, more leaks have enriched the configuration information of Nova Lake processors, including support for DDR5-8000 memory, LGA1954 package, etc. I believe that readers who have been paying attention to Intel PC processors for a long time may be a little surprised by the leaked 52 cores.

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Major Breakthrough: TSMC Has Achieved The First Batch of 4nm Wafer Manufacturing In Arizona Factory

Major Breakthrough: TSMC Has Achieved The First Batch of 4nm Wafer Manufacturing In Arizona Factory

In June 2025, TSMC's Fab 21 in Arizona marked a historic milestone for U.S. semiconductor manufacturing by completing its first batch of 4nm wafers—totaling 20,000 units.

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Huawei's Quad-Chiplet Patent Exposed, May Be Used for AI Chip Ascend 910D

Huawei's Quad-Chiplet Patent Exposed, May Be Used for AI Chip Ascend 910D

The analysis pointed out that Huawei's four-chip packaging architecture has technical similarities with NVIDIA's Rubin Ultra platform planned to be launched in 2026. The latter uses TSMC's CoWoS-L technology to integrate four GPUs and six HBM3E memories, while Huawei's patent achieves a similar effect through self-developed packaging technology.

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Abouts Us

WORLD-CLASS ELECTRONIC COMPONENTS DISTRIBUTOR

LoveChip is a globally recognized leader in the distribution of electronic components, boasting extensive partnerships with prestigious brands and top-tier suppliers. Our commitment to excellence ensures that we consistently deliver high-quality products that exceed industry standards and cater to diverse customer needs.

Certified with ISO 14001, ISO 9001, and Dun & Bradstreet, LoveChip demonstrates an unwavering dedication to sustainability, quality management, and financial stability. These certifications are a testament to our relentless pursuit of innovation and superior service. At LoveChip, we don't just meet expectations—we set new benchmarks in the electronic components industry.

Choose LoveChip for unparalleled quality, reliability, and service excellence. Your success is our mission.

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