IPB60R299CPAATMA1 Infineon Technologies

The IPB60R299CPAATMA1 from Infineon Technologies is a high-performance 600V CoolMOS™ P7 power MOSFET in a TO-263-3 (D2PAK) surface-mount package. This N-channel transistor is engineered for demanding automotive-grade applications, offering an optimized balance of low on-state resistance (RDS(on)) and high switching efficiency. Its advanced superjunction technology ensures robust performance in power conversion stages. Key specifications include its 600V drain-source voltage rating and the 299mΩ typical RDS(on). This component is primarily targeted at automotive systems, such as DC-DC converters and motor control units, where reliability and efficiency under harsh conditions are paramount.

Features

• Automotive Grade Qualification: Designed and specified for the rigorous reliability and quality standards required in automotive electronic systems (AEC-Q101).
• High Voltage Capability: Features a 600V drain-source voltage rating, suitable for off-line and high-voltage DC-DC conversion applications.
• Optimized Switching Performance: Utilizes Infineon's CoolMOS™ P7 technology for low switching losses and high efficiency in hard- and soft-switching topologies.
• Halogen-Free & Pb-Free Design: Compliant with environmental regulations, using halogen-free mold compound and lead-free plating (note: not completely Pb-Free per spec).

Technical Specifications

• Part Number: IPB60R299CPAATMA1
• Technology: CoolMOS™ P7
• Drain-Source Voltage (VDS): 600 V
• On-State Resistance (RDS(on)): 299 mΩ (typical)
• Package: PG-TO263-3 (D2PAK)
• Mounting Type: Surface Mount
• Packing: Tape & Reel
• Moisture Sensitivity Level (MSL): MSL 1 - Unlimited Floor Life
• Product Status: Not for new design

Pin Configuration and Functions

• Pin1 (Gate): Control terminal. Applying a voltage between Gate and Source controls the conductivity of the MOSFET channel.
• Pin2 (Drain): Power terminal. The main current flows into the MOSFET through the Drain when the device is turned on.
• Pin3 (Source): Power and reference terminal. The main current exits the MOSFET here. It also serves as the common reference for the Gate control signal.

Typical Applications

• Automotive DC-DC Converters: Primary-side switch in 48V to 12V or other high-voltage conversion systems.
• On-Board Charger (OBC) Circuits: Used in PFC (Power Factor Correction) and subsequent DC-DC stages for electric vehicle charging.
• Motor Drive Inverters: Switching element in H-bridge or three-phase inverter circuits for controlling BLDC or PMS motors.
• Industrial SMPS: Primary switch in switch-mode power supplies requiring high voltage and robust performance.

Equivalent / Alternative Parts

• IPBE65R230CFD7A (Infineon): A closely related alternative from the same CoolMOS™ family, offering a similar voltage class and package for design flexibility.

Advantages

• Superior Reliability for Automotive Use: Built to meet stringent automotive quality grades (AEC-Q101), ensuring long-term performance in temperature-cycling and high-vibration environments.
• Excellent Thermal Performance: The D2PAK (TO-263) package features a large metal tab for direct mounting to a PCB heatsink, enabling efficient power dissipation.
• MSL 1 for Simplified Handling: With a Moisture Sensitivity Level of 1, this component does not require dry packing or baking before use, simplifying inventory and assembly processes.

Limitations

• Not for New Designs: The product status is marked as "not for new design," indicating it is being phased out in favor of newer generations; not recommended for new projects.
• Package Size: The D2PAK package, while good for thermal performance, occupies significant PCB area compared to newer packages like DPAK or LFPAK, limiting use in space-constrained designs.
• Gate Drive Considerations: As a high-voltage MOSFET, it requires careful gate drive design with proper voltage levels and protection to prevent shoot-through and ensure fast, reliable switching.

Package Information

TO-263-3 package (marketing name D2PAK), approximate size 10.28mm x 15.11mm (excluding leads), 3 pins, surface mount design with an exposed metal pad on the bottom for enhanced thermal dissipation.

Manufacturer Information

Infineon Technologies AG is a global leader in semiconductor solutions, with a strong focus on automotive, industrial, and power management applications. The company is renowned for its innovation in power semiconductors, microcontrollers, and security ICs. Its automotive components are developed to meet the industry's highest quality and reliability standards.

Design-in Tips

• Optimize Thermal Management: Ensure the PCB layout provides an adequate copper area (thermal pad) under the device's metal tab and consider using thermal vias to transfer heat to inner or bottom layers.
• Implement Robust Gate Driving: Use a dedicated gate driver IC with appropriate current capability. Keep gate loop inductance minimal and consider a small external gate resistor to control switching speed and mitigate ringing.
• Check for End-of-Life Status: Before finalizing a new design, verify the availability and long-term supply status of this component, as it is marked "not for new design," and evaluate recommended alternatives.

Lifecycle Status & PCN/PDN Notes

Lifecycle Status: Not for new design. This indicates the product is in a phase-out stage and may have limited long-term availability. No specific Product Change Notification (PCN) or Product Discontinuation Notification (PDN) information is provided with the current parameters.