MICROFJ-30020-TSV-TR1 Onsemi

The MICROFJ-30020-TSV-TR1 from Onsemi is a high-performance silicon photomultiplier (SiPM) in a compact WBGA-8 package. As part of the MICROFJ series, this single-element sensor features a 3mm x 3mm active area composed of microcells with a 20µm pitch, optimized for 420nm wavelength detection. It delivers a high photon detection efficiency (PDE) of 38% at maximum overvoltage and a typical dark count rate (DCR) of 50 KHz/mm². This component is designed for applications requiring ultra-sensitive, low-light detection and fast timing, such as medical imaging, LiDAR, and high-energy physics.

Features

• High Photon Detection Efficiency: Achieves 38% PDE at peak sensitivity, enabling excellent signal-to-noise ratio in low-light conditions.
• Optimized Spectral Response: Peak sensitivity at 420nm wavelength, making it ideal for detecting blue/violet light sources and scintillation events.
• Low Dark Count Rate: Typical DCR of 50 KHz/mm² minimizes noise for clearer signal acquisition.
• Compact Array Format: Single-element sensor with a 3x3mm active area in a miniature WBGA package for space-constrained designs.

Technical Specifications

• Status: Active
• Compliance: PbAHP
• Package Type: ODCSP-8 (WBGA-8)
• Case Outline: 570CS
• MSL Rating: MSL 4 @ 260°C
• Active Area: 3 mm x 3 mm
• Microcell Pitch: 20 µm
• Peak Wavelength: 420 nm
• Photon Detection Efficiency (PDE): 38% @ Max Overvoltage
• Dark Count Rate (DCR): 50 KHz/mm² @ Typical Overvoltage

Pin Configuration and Functions

• Pin1: Cathode: Common cathode connection for the SiPM array.
• Pin2: Anode 1: Anode output for signal readout.
• Pin3: NC: No internal connection.
• Pin4: NC: No internal connection.
• Pin5: NC: No internal connection.
• Pin6: NC: No internal connection.
• Pin7: Anode 2: Anode output; typically tied to Anode 1 for single-ended operation.
• Pin8: NC: No internal connection.

Typical Applications

• Medical Imaging: Readout sensor for positron emission tomography (PET) and time-of-flight PET (TOF-PET) systems.
• LiDAR and Ranging: Receiver in high-resolution, short-range LiDAR for automotive and industrial sensing.
• High-Energy Physics: Particle detection and calorimetry in experimental setups.
• Fluorescence Detection: Low-light sensing in analytical and laboratory instrumentation.

Equivalent / Alternative Parts

• MICROFJ-30020-TSV (Onsemi) - Same die and core specifications, differing only in tape and reel packaging (TR1 suffix).
• MICROFJ-30035-TSV (Onsemi) - Similar form factor and package with a larger 35µm microcell size, offering a trade-off between PDE and dynamic range.

Advantages

• Superior Low-Light Performance: The combination of high PDE and low DCR provides exceptional sensitivity, crucial for detecting weak optical signals.
• Miniaturized Form Factor: The WBGA-8 (ODCSP-8) package enables integration into compact modules and systems where board space is at a premium.
• Fast Timing Capability: Inherent SiPM technology offers excellent timing resolution, beneficial for time-critical applications like TOF-PET and LiDAR.

Limitations

• Spectral Range Limitation: Peak sensitivity at 420nm makes it less efficient for detecting light in the far red or near-infrared spectrum.
• Temperature Sensitivity: Like all SiPMs, DCR and gain are temperature-dependent, requiring thermal management or calibration in precision systems.
• Limited Active Area: The 3x3mm single-element format is not suitable for applications requiring large-area or multi-channel spatial detection.

Package Information

Wafer-level chip-scale package (ODCSP-8/WBGA-8), with dimensions defined by case outline 570CS. This is an ultra-compact, surface-mount device designed for high-density PCB assembly.

Manufacturer Information

Onsemi is a leading global supplier of semiconductor-based solutions, renowned for its portfolio of power management, sensing, and analog devices. The company drives innovation in key markets including automotive, industrial, and cloud power, with a strong commitment to reliable and energy-efficient technologies.

Design-in Tips

• Handle with ESD Precautions: This is an ESD-sensitive device. Always use proper grounding procedures during handling and assembly.
• Follow MSL Guidelines: Adhere to Moisture Sensitivity Level 4 (MSL 4) protocols. The device must be baked before soldering if exposed to ambient conditions beyond its floor life.
• Optimize PCB Layout: Ensure clean, low-noise power supply routing to the SiPM and use a controlled-impedance path for the fast analog output signal to minimize interference.

Lifecycle Status & PCN/PDN Notes

Lifecycle Status: Active. No product change notifications (PCN) or product discontinuation notices (PDN) are currently associated with this part number.