UCSP-50
(Total of 8 parts)| Mfr No | Description | Manufacturer | Category | Inventory | Add To Bom |
|---|---|---|---|---|---|
 BD83854GWL-E2 | High-precision LCD driver for precise display control | ROHM Semiconductor | Special Purpose Regulators | 3942 | |
| BRCB016GWL-3E2 | A compact, high-capacity serial communication solution for a wide range of applications and operating environments | ROHM Semiconductor | Memory | 3093 | |
| BD11670GWL-E2 | Compact DPDT USB switch IC for versatile application | ROHM Semiconductor | Analog Switches , Special Purpose | 6062 | |
| BD83850GWL-E2 | Inverter output powers TFT-LCD displays with precision and accuracy guaranteed | ROHM Semiconductor | Special Purpose Regulators | 4382 | |
| BD65B60GWL-E2 | Driver designed for white LEDs with a maximum output of 28.5V for 2 strings | ROHM Semiconductor | LED Drivers | 6538 | |
| BD71801GWL-E2 | Advanced PMIC solutions for fast charging and high-power devices: Efficient energy transfer, reduced heat generatio | ROHM Semiconductor | Power Management , Specialized | 6152 | |
| BD57015GWL-E2 | Qi Wireless Receiver ICs for seamless power transfer | ROHM Semiconductor | Power Management , Specialized | 4108 | |
| BD83070GWL-E2 | Dual-function power supply with 2 A switches | ROHM Semiconductor | Voltage Regulators , DC DC Switching Regulators | 7534 |
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About UCSP-50
The UCSP-50 (Micro Wafer-Level Chip-Scale Package) is a type of advanced electronic component packaging designed for compact and high-density applications. Here’s an overview of its key features and characteristics:
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Compact Size:
The UCSP-50 is a wafer-level chip-scale package, meaning it is extremely small and lightweight. It is designed to be as close as possible to the size of the semiconductor die itself, making it ideal for space-constrained applications. -
Pin Configuration:
The "50" in UCSP-50 typically refers to the number of input/output (I/O) connections or pads on the package. These pads are arranged in a grid pattern on the bottom side of the package, allowing for efficient routing and connectivity. -
Material and Structure:
The package is made using wafer-level processing techniques, which involve building the package directly on the silicon wafer. This results in a thin, low-profile structure with excellent electrical performance. -
Applications:
UCSP-50 is commonly used in portable electronics, IoT devices, wearable technology, and other applications where miniaturization and low power consumption are critical. It is particularly suitable for RF components, sensors, and power management ICs. -
Advantages:
- Small footprint: Saves valuable PCB space.
- Lightweight: Ideal for portable and wearable devices.
- Improved electrical performance: Shorter interconnects reduce parasitic effects.
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Cost-effective: Wafer-level packaging reduces manufacturing costs.
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Challenges:
- Handling and assembly: Due to its small size, specialized equipment and techniques are required for soldering and placement.
- Thermal management: The compact design may require careful thermal considerations to prevent overheating.
In summary, the UCSP-50 is a highly efficient and compact packaging solution for modern electronic devices, offering significant advantages in size, weight, and performance. However, its use requires precision in manufacturing and assembly processes.