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UC-56

(Total of 6 parts)
Mfr NoDescriptionManufacturerCategoryInventoryAdd To Bom
PCF8576CU/F1,026PCF8576CU/F1,026Universal LCD driver for low multiplex ratesNXP SemiconductorsDisplay Drivers5827
PCF8576CU/2/F2,026PCF8576CU/2/F2,026Control your LCD with ease using PCF8576CU/2/F2026NXP SemiconductorsDisplay Drivers7062
PCF8576CU/12E/2,00PCF8576CU/12E/2,00Effortlessly drive low-multiplex LCD displays with ease.NXP SemiconductorsDisplay Drivers2615
PCF8576CU/10/F1,00PCF8576CU/10/F1,00Advanced interface management for precise LCD display control.NXP SemiconductorsDisplay Drivers7439
PCF8576CU/2/F2,028PCF8576CU/2/F2,028Precise control of LCD displays with this high-performance PCF8576CU/2/F2 driver.NXP SemiconductorsDisplay Drivers4727
PCF8576CU/F1,028PCF8576CU/F1,028Elevate your display game with this innovative IC featuring high-speed data transfer capabilities.NXP SemiconductorsDisplay Drivers7992

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About UC-56

The UC-56 is a type of electronic component package, commonly used for devices such as diodes, transistors, or other small semiconductor components. It is a surface-mount device (SMD) package, designed to be mounted directly onto the surface of a printed circuit board (PCB). Here’s an overview of the UC-56 package:

Key Features of UC-56 Package:

  1. Compact Size: The UC-56 package is relatively small, making it suitable for applications where space on the PCB is limited.
  2. Surface-Mount Design: It is designed for surface-mount technology (SMT), which allows for automated assembly processes and reduces the need for through-hole mounting.
  3. Leads: The package typically has two or more leads (pins) that are designed to be soldered directly onto the PCB pads.
  4. Material: The package is usually made of a plastic or ceramic material, providing insulation and protection for the internal semiconductor device.
  5. Thermal Performance: The UC-56 package is designed to efficiently dissipate heat, which is important for maintaining the reliability and performance of the component.

Applications:

The UC-56 package is commonly used in a variety of electronic devices and systems, including: - Consumer electronics - Telecommunications equipment - Automotive electronics - Industrial control systems - Power management circuits

Advantages:

  • Space Efficiency: Its small size allows for high-density PCB designs.
  • Cost-Effective: Suitable for mass production due to its compatibility with automated assembly processes.
  • Reliability: Provides good electrical and thermal performance, ensuring the longevity of the component.

Considerations:

  • Handling: Due to its small size, careful handling and precise soldering techniques are required during assembly.
  • Thermal Management: Proper PCB design and thermal management practices are necessary to ensure optimal performance.

In summary, the UC-56 package is a versatile and widely used surface-mount package for small electronic components, offering a balance of size, performance, and cost-effectiveness for modern electronic designs.