TSOP-44
(Total of 967 parts)| Mfr No | Description | Manufacturer | Category | Inventory | Add To Bom |
|---|---|---|---|---|---|
 71016S15PHG | High-performance SRAM chip for demanding applications | Renesas Electronics Corporation | Memory | 5373 | |
| 71016S15PHGI | 1 megabit, 44-pin TSOP II package, ideal for space-constrained designs | Renesas Electronics Corporation | Memory | 7610 | |
| 71016S15PHGI8 | 64K x 16-bit RAM for large-scale applications | Renesas Electronics Corporation | Memory | 6663 | |
| 71016S20PHG | The PHG product offers reliable data retention and excellent noise immunity, making it suitable for use in industrial control system | Renesas Electronics Corporation | Memory | 3423 | |
| 71016S20PHGI8 | Ultra-fast data transfer and access time make it suitable for multimedia-intensive projects | Renesas Electronics Corporation | Memory | 7287 | |
| M3004316035NX0ITAY | Advanced memory solution for storing small amounts of data in a compact -pin TSOP packag | Renesas Electronics Corporation | Memory | 2271 | |
| M3004316035NX0ITAR | MRAM (Magnetoresistive RAM) Memory IC 4Mbit Parallel 35 ns 44-TSOP II | Renesas Electronics Corporation | Memory | 3233 | |
| M3004316045NX0ITAY | High-Density, Low-Power MRAM for Next-Generation Computi | Renesas Electronics Corporation | Memory | 2835 | |
| M3004316045NX0ITAR | Parallel memory solution providing high-capacity storage (4MB) and low latency (35ns), perfect for demanding applications | Renesas Electronics Corporation | Memory | 5107 | |
| M3004316035NX0PTAY | Robust and efficient NVRAM MRAM parallel memory chip for high-reliability systems desig | Renesas Electronics Corporation | Memory | 3657 | |
| M3004316035NX0PTAR | High-density MRAM solution featuring 4Mbit capacity and reliable 44-Pin TSOP package | Renesas Electronics Corporation | Memory | 2817 | |
| M3004316045NX0PTAY | Parallel interface enables efficient data transfer and processing | Renesas Electronics Corporation | Memory | 3615 | |
| M3004316045NX0PTAR | Advanced memory technology for efficient data transfer and processin | Renesas Electronics Corporation | Memory | 4793 | |
| R1RP0416DSB-2LR#S1 | SRAM - Asynchronous Memory IC 4Mbit Parallel 12 ns 44-TSOP II | Renesas Electronics Corporation | Memory | 4709 | |
| R1RP0416DSB-2PR#S1 | SRAM - Asynchronous Memory IC 4Mbit Parallel 12 ns 44-TSOP II | Renesas Electronics Corporation | Memory | 3577 | |
| R1RP0416DSB-2LR#D1 | R1RP0416DSB-2LR#D1 | Renesas Electronics Corporation | Memory | 6274 | |
| R1RW0416DSB-0PI#D0 | Rapidly access and store large amounts of data quickly | Renesas Electronics Corporation | Memory | 4704 | |
| R1RW0416DSB-0PI#D1 | Wide temperature range ensures reliable operation in harsh environment | Renesas Electronics Corporation | Memory | 4576 | |
| R1RW0416DSB-2PI#D0 | High-performance SRAM chip for reliable data storag | Renesas Electronics Corporation | Memory | 7078 | |
| R1RW0416DSB-2PI#D1 | Compact and reliable, this TSOPII-44 SRAM module offers high-speed data transfer for various industrial applications | Renesas Electronics Corporation | Memory | 5005 | |
| R1RW0416DSB-0PI#S1 | High-performance SRAM chip for fast data storage and retrieval | Renesas Electronics Corporation | Memory | 3689 | |
| R1RW0416DSB-2PI#S1 | Industrial-grade SRAM with extreme temperature tolerance | Renesas Electronics Corporation | Memory | 7321 | |
| R1RW0416DSB-2SR#D1 | 4M High-speed SRAM (256-kword × 16-bit) | Renesas Electronics Corporation | Memory | 7641 | |
| R1RW0416DSB-0PR#S1 | Boost your system's performance with this 4M-bit SRAM chip | Renesas Electronics Corporation | Memory | 6982 | |
| R1RW0416DSB-2LR#D1 | Asynchronous memory solution for fast and reliable data storag | Renesas Electronics Corporation | Memory | 2484 | |
| R1RW0416DSB-2PR#S1 | A high-performance SRAM solution for applications requiring low latency and high bandwidth | Renesas Electronics Corporation | Memory | 6890 | |
| R1LV0216BSB-5SI#B0 | Single 3V module with 2M-bit memory capacity | Renesas Electronics Corporation | Memory | 5245 | |
| R1LV0216BSB-5SI#B1 | High-density storage for microcontrollers and embedded systems | Renesas Electronics Corporation | Memory | 3897 | |
| R1LV0216BSB-5SI#S0 | Low-voltage, high-density RAM solution ideal for automotive, industrial and medical devices | Renesas Electronics Corporation | Memory | 6122 | |
| RMLV0414EGSB-4S2#AA0 | Ideal for use in industrial and commercial electronics products | Renesas Electronics Corporation | Memory | 2715 | |
| RMLV0414EGSB-4S2#AA1 | The RMLV04-14EGSB-4S2#AA1 module provides a high-speed interface for your system's memory needs | Renesas Electronics Corporation | Memory | 5890 | |
| RMLV0414EGSB-4S2#HA0 | Advanced memory solution for high-speed data processing | Renesas Electronics Corporation | Memory | 7864 | |
| RMLV0414EGSB-4S2#HA1 | Designed for high-speed performance | Renesas Electronics Corporation | Memory | 2844 | |
| RMLV0416EGSB-4S2#HA0 | Enhanced memory performance with ns access tim | Renesas Electronics Corporation | Memory | 2646 | |
| RMLV0808BGSB-4S2#AA0 | Ultra-fast access times of 45ns for efficient data processing | Renesas Electronics Corporation | Memory | 2994 | |
| RMLV0816BGSB-4S2#HA0 | High-performance SRAM chip for asynchronous applications, offering exceptional speed and low power consumption | Renesas Electronics Corporation | Memory | 3506 | |
| 71V016SA10PHGI | Compact and reliable memory solution for rugged environments | Renesas Electronics Corporation | Memory | 2972 | |
| 71V016SA12PHG | IC SRAM 1MBIT PARALLEL 44TSOP II | Renesas Electronics Corporation | Memory | 5837 | |
| 71V016SA12PHG8 | Powerful memory module for demanding systems requiremen | Renesas Electronics Corporation | Memory | 7170 | |
| 71V016SA12PHGI | High-capacity, low-voltage memory solution for efficient data storage | Renesas Electronics Corporation | Memory | 4010 | |
| 71V016SA15PHG | Compact and reliable SRAM chip for industrial control system | Renesas Electronics Corporation | Memory | 7865 | |
| 71V016SA15PHGI | High-reliability memory solution for industrial applicatio | Renesas Electronics Corporation | Memory | 7386 | |
| 71V016SA15PHGI8 | Features a fast access time and a low power consumption profil | Renesas Electronics Corporation | Memory | 5157 | |
| 71V016SA20PHG8 | Low-power consumption and high-speed data transfer make this SRAM ideal for real-time applications | Renesas Electronics Corporation | Memory | 3624 | |
| 71V016SA20PHGI | Scalable and fast asynchronous SRAM technology for embedded systems, IoT, and automotive applications | Renesas Electronics Corporation | Memory | 7776 | |
| 71V416L10PHGI8 | CMOS technology ensures reliable and efficient memory access | Renesas Electronics Corporation | Memory | 2353 | |
| 71V416L12PHG | Designed for high-performance computing and data storage, this 256K x 16 RAM chip is a reliable choice for demanding systems | Renesas Electronics Corporation | Memory | 6541 | |
| 71V416L12PHGI8 | High-density synchronous RAM module with fast access times and low power consumption | Renesas Electronics Corporation | Memory | 3390 | |
| 71V416L15PHG | Premium component for mission-critical systems and processe | Renesas Electronics Corporation | Memory | 6889 | |
| 71V416L15PHG8 | Pin-compatible center power and ground interface for easy integration | Renesas Electronics Corporation | Memory | 5929 | |
| 71V416L15PHGI8 | CMOS SRAM module with fast access times and low power consumptio | Renesas Electronics Corporation | Memory | 5818 | |
| 71V416S10PHG | 256Kx16 asynchronous SRAM chip for seamless communication protocols | Renesas Electronics Corporation | Memory | 6547 | |
| 71V416S10PHGI | Compact and reliable, this 256K x 16 asynchronous static RAM is perfect for space-constrained designs requiring precise data storage and retrieval | Renesas Electronics Corporation | Memory | 4721 | |
| 71V416S12PHG | Advanced memory solution with fast access time and low power consumption | Renesas Electronics Corporation | Memory | 2804 | |
| 71V416S12PHG8 | High-performance and high-reliability, the 71V416 series is ideal for systems requiring fast data transfer and storage | Renesas Electronics Corporation | Memory | 2633 | |
| 71V416S12PHGI8 | Enhance your system's memory capabilities with this high-speed, low-voltage asynchronous SRAM IC solution | Renesas Electronics Corporation | Memory | 6890 | |
| 71V416S15PHG | 56Kx16 ASYNCHRONOUS 3.3V CMOS SRAM | Renesas Electronics Corporation | Memory | 2129 | |
| 71V416S15PHG8 | SRAM - Asynchronous Memory IC 4Mb (256K x 16) Parallel 15ns 44-TSOP II | Renesas Electronics Corporation | Memory | 4382 | |
| 71V416S15PHGI | Product 71V416S15PHGI is a 4 Mb (256K x 16) static RAM, designed for surface mount application with a 3 | Renesas Electronics Corporation | Memory | 4253 | |
| 71V416S15PHGI8 | High-speed operation ideal for various applications | Renesas Electronics Corporation | Memory | 6631 |
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About TSOP-44
TSOP-44 Package Overview
TSOP stands for Thin Small Outline Package, and TSOP-44 is a specific type of surface-mount package with 44 pins. It is widely used in the electronics industry for packaging memory devices such as Flash memory, DRAM, and SRAM, as well as other integrated circuits (ICs). Here’s a detailed introduction to the TSOP-44 package:
Key Features of TSOP-44
- Package Type:
-
TSOP-44 is a surface-mount package, meaning it is designed to be soldered directly onto the surface of a printed circuit board (PCB).
-
Pin Count:
-
It has 44 pins arranged in two rows along the longer sides of the package.
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Dimensions:
- The package is thin and compact, making it suitable for applications where space is limited.
-
Typical dimensions:
- Length: ~18.4 mm
- Width: ~10.16 mm
- Height: ~1.2 mm (varies slightly depending on the manufacturer).
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Pin Spacing:
-
The pins are spaced at 0.8 mm (millimeters) pitch, which is standard for TSOP packages.
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Material:
- The package is typically made of plastic, providing a lightweight and cost-effective solution.
Advantages of TSOP-44
- Compact Size: Its small footprint allows for high-density PCB designs.
- Lightweight: Ideal for portable and handheld devices.
- Cost-Effective: Economical for mass production.
- Ease of Assembly: Suitable for automated surface-mount technology (SMT) processes.
Applications
TSOP-44 is commonly used in:
- Memory Devices: Flash memory, DRAM, SRAM, and EEPROM.
- Consumer Electronics: Smartphones, tablets, digital cameras, and USB drives.
- Industrial and Automotive Electronics: Embedded systems and control modules.
Soldering and Handling
- Soldering Method: TSOP-44 packages are soldered using reflow soldering techniques.
- Handling Precautions: Care must be taken to avoid bending or damaging the thin pins during assembly.
Comparison with Other Packages
- TSOP vs. BGA: TSOP is easier to inspect and rework compared to Ball Grid Array (BGA) packages.
- TSOP vs. QFP: TSOP is thinner and lighter than Quad Flat Package (QFP) variants.
In summary, the TSOP-44 package is a reliable and widely used solution for packaging memory and other ICs, offering a balance of compactness, cost-effectiveness, and ease of assembly.