SO-8C-7

The SO-8C-7 is a type of surface-mount package used for electronic components, particularly integrated circuits (ICs). Here’s an overview of its key features:

1. Package Type: SO-8C-7 belongs to the Small Outline (SO) family, which is widely used for ICs due to its compact size and suitability for automated assembly processes.

2. Pin Count: The "8" in SO-8C-7 indicates that the package has 8 pins or leads. These pins are arranged along the two longer sides of the package.

3. Dimensions: The package is small and flat, with standardized dimensions to ensure compatibility with surface-mount technology (SMT). The exact dimensions (e.g., length, width, and height) are defined by industry standards.

4. Mounting Style: It is designed for surface-mount technology (SMT), meaning it is soldered directly onto the surface of a printed circuit board (PCB) rather than through-hole mounting.

5. Applications: The SO-8C-7 package is commonly used for a variety of ICs, such as operational amplifiers, voltage regulators, and other small-scale integrated circuits.

6. Thermal and Electrical Performance: The package is designed to provide good thermal and electrical performance, making it suitable for a range of electronic applications.

7. Coding: The "C" and "7" in SO-8C-7 may refer to specific variations or customizations of the standard SO-8 package, such as lead pitch, material, or thermal properties. These details are often defined by the manufacturer.

Overall, the SO-8C-7 is a versatile and widely used package in the electronics industry, offering a balance of size, performance, and ease of assembly.