ETQFP-64

(Total of 5 parts)

Mfr No	Description	Manufacturer	Category	Inventory
SPC58EC80E1Q0C0Y	Microcontroller for industrial automation and robotics applications, featuring high-speed processing and reliable connectivity	STMicroelectronics NV	Microcontrollers	7856
SPC58EC80E1Q0C0X	High-performance MCU for automotive applications, featuring advanced RISC architecture and vast flash memory capacity	STMicroelectronics NV	Microcontrollers	5902
ZL30414QGG1	Low power consumption and high reliability make it ideal for telecommunications.	Microchip Technology	Application Specific Clock/Timing	4364
SPC584C70E1F0C0X	State-of-the-art MCU with enhanced peripherals and memory for demanding industrial control and automation projects, compact 64-pin TQFP package	STMicroelectronics NV	Microcontrollers	7158
ZL30406QGG1	High-speed clock generator for precision timing applications	Microchip Technology	Application Specific Clock/Timing	7919

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About ETQFP-64

ETQFP-64 is a type of surface-mount integrated circuit (IC) package, which stands for Exposed Thin Quad Flat Pack with 64 pins. This package is widely used in electronics for its compact size, efficient thermal performance, and high pin density. Here’s a detailed introduction to the ETQFP-64 package:

Key Features:

Package Type:
ETQFP-64 is a quad flat pack (QFP) variant, meaning the pins are arranged on all four sides of the package.
The "Exposed" feature refers to an exposed pad on the bottom of the package, which enhances thermal dissipation by allowing direct contact with the PCB (Printed Circuit Board).
Pin Count:
The package has 64 pins, making it suitable for medium-complexity ICs that require a moderate number of input/output connections.
Size and Dimensions:
The package is designed to be thin and compact, making it ideal for space-constrained applications.
Typical body size is around 10mm x 10mm, though exact dimensions may vary depending on the manufacturer.
Thermal Performance:
The exposed pad at the bottom of the package improves heat dissipation, which is crucial for high-performance or power-hungry ICs.
This feature makes ETQFP-64 suitable for applications requiring efficient thermal management.
Mounting Style:
ETQFP-64 is a surface-mount device (SMD), meaning it is soldered directly onto the surface of the PCB.
The pins are typically arranged in a gull-wing shape, which facilitates soldering and inspection.
Applications:
ETQFP-64 is commonly used in consumer electronics, industrial automation, telecommunications, and automotive electronics.
It is ideal for microcontrollers, processors, and other ICs that require a balance between pin count, size, and thermal performance.

Advantages:

Compact Design: Saves space on the PCB, enabling smaller and more efficient designs.
Improved Heat Dissipation: The exposed pad ensures better thermal performance, reducing the risk of overheating.
High Pin Density: Supports a moderate number of connections without significantly increasing the package size.
Reliability: Surface-mount technology ensures strong mechanical and electrical connections.

Disadvantages:

Soldering Complexity: The small size and high pin density can make soldering and inspection more challenging.
Cost: May be more expensive than simpler packages due to its advanced design and thermal features.

Summary:

The ETQFP-64 package is a versatile and efficient solution for modern electronics, offering a compact footprint, excellent thermal performance, and a moderate pin count. Its exposed pad design makes it particularly suitable for applications requiring robust thermal management, while its surface-mount compatibility ensures ease of integration into PCB designs.

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