BGA-304
(Total of 7 parts)| Mfr No | Description | Manufacturer | Category | Inventory | Add To Bom |
|---|---|---|---|---|---|
 XRT83VSH314IB | Robust and compact design for industrial automation use cases | MaxLinear, Inc | Telecom | 6230 | |
| Top-of-the-line 432-pin design for reliable connectivity | Intel | Controllers | 7642 | ||
| High-speed analog and digital signal routing for complex system designs | Analog Devices | Analog Switches , Special Purpose | 6467 | ||
| Enables high-bandwidth, low-latency data transfer and processin | Analog Devices | Analog Switches , Special Purpose | 5341 | ||
| AD8117ABPZ | High-Speed Video Processing for Complex System | Analog Devices | Analog Switches , Special Purpose | 3478 | |
| PM5351-BGI | ATM UNI Quad 155.52Mbps 3.3V 304-Pin BGA | Microchip Technology | Telecom | 3304 | |
| AD8104ABPZ | Compact cross-point switch for efficient signal routing | Analog Devices | Analog Switches , Special Purpose | 4386 |
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About BGA-304
BGA-304 Package Overview
The BGA-304 (Ball Grid Array with 304 pins) is a type of surface-mount packaging used for integrated circuits (ICs) and other electronic components. It is designed to provide a high-density interconnection solution, making it suitable for complex and high-performance devices such as microprocessors, FPGAs, and memory chips.
Key Features of BGA-304:
- High Pin Count: The "304" in BGA-304 refers to the number of solder balls (pins) arranged in a grid pattern on the underside of the package. This allows for a large number of connections in a compact form factor.
- Compact Design: BGA packages are known for their space efficiency, as the solder balls are placed directly beneath the chip, reducing the overall footprint compared to traditional packages like QFP (Quad Flat Package).
- Improved Electrical Performance: The shorter electrical paths between the die and the PCB reduce inductance and capacitance, enhancing signal integrity and enabling higher-speed operation.
- Thermal Efficiency: The BGA design allows for better heat dissipation, as the solder balls can conduct heat to the PCB more effectively. Some BGA packages also include a thermal pad or heat spreader for improved thermal management.
- Reliability: The solder balls provide robust mechanical and electrical connections, making BGA packages reliable for demanding applications.
Applications:
BGA-304 packages are commonly used in: - High-performance computing devices (e.g., CPUs, GPUs) - Networking and telecommunications equipment - Industrial and automotive electronics - Consumer electronics (e.g., smartphones, tablets)
Assembly Considerations:
- Soldering: BGA packages require precise soldering techniques, often using reflow soldering processes. The solder balls melt during assembly to form connections with the PCB.
- Inspection: Due to the hidden nature of the solder joints, inspection typically requires X-ray imaging to ensure proper alignment and soldering.
- Rework: Repairing or replacing BGA components can be challenging and often requires specialized equipment.
In summary, the BGA-304 package is a high-density, reliable, and efficient solution for modern electronic devices, particularly those requiring a large number of connections in a compact form factor.